McDermid solder-based thermal conductive materials
McDermid solder-based thermal interface material sTIM solves thermal issues in high-performance power semiconductors.
sTIM (Solder Thermal Interface Material) is a non-adhesive, non-organic solder-based thermal interface material. It achieves high thermal conductivity for high-performance power semiconductor applications, which are approaching the limits of conventional organic TIMs, supporting next-generation thermal management. MacDermid Alpha is a global supplier in the semiconductor packaging field and has a track record of receiving the Intel SCQI Award in the thermal interface materials sector.
- Company：セイワ 東京本社、関西支社、名古屋営業所、中国無錫 グループ会社 エレクトロン（長野県松本市）
- Price：Other
